ICT apparatus

Optical backplane for interconnection between boards of a high-capacity ICT apparatus, data-center, server and the related automatic assembly method. The solution is based on optical connections between boards with an optimized layout on a support with mechanical constraints that involve controlled deformations of commercial optical fibers with standardized connectors. The entire interconnection circuit is divided into N independent circuits, each of which makes the connections between all the boards (Full-Mesh).